| 摘要 |
While the lens fitting member is temporarily bonded on the printed circuit board by a semi-hardening adhesive, the lens fitting member is located so as to adjust the lens to a specific position in relation to the solid-state image sensing element, and the semi-hardening adhesive is then hardened to completely bond the lens fitting member on the printed circuit board, thus reducing the assembly man-hour of a solid-state image sensing device in which a solid-state image sensing element is mounted on a printed circuit board and a lens fitting member with a lens fitted on is provided so as to adjust the lens to a specific position in relation to the solid-state image sensing element.
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