| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit module excellently connecting parts by reducing thermal and mechanical damage received by the electronic parts, a substrate, etc. SOLUTION: A sudden rise from the normal temperature of the temperatures of the whole electronic parts and the whole laser-beam transmitting substrate 3 is prevented and the thermal damage of the electronic parts and the substrate can be reduced by irradiating substrate electrodes 3a (bumps 2) with laser beams LB through the substrate 3 while stress generated due to the difference of thermal expansion coefficients is decreased, and the mechanical damage of the electronic parts and the substrate can be diminished. Thermal energy required for connecting the parts is supplemented by either one of heat and ultrasonic vibrations by imparting either one of heat and ultrasonic vibrations to the bumps 2 at the same time as the irradiation of laser beams LB, and the connecting time of the parts can be shortened. |
