| 摘要 |
PROBLEM TO BE SOLVED: To perform automatic transfer, assembly, measurement, etc., on a surface mount light emitting diode constituted in a micro CSP(chip size package) in the same way as those performed on an ordinary individual parts by constituting the diode having a structure such that the polarity can be recognized. SOLUTION: A light emitting diode having an anode plate 2 and a cathode plate 5 on the surface of a light emitting diode element chip 1 parallel to the P-N junction section 1a of the ship 1 is constituted in such a structure that can make the polarities of electrodes physically recognizable by molding the side face section of the chip 1 with a light transmitting resin 6 and forming the surface of one electrode plate of the diode in a recessed shape 2a, both electrode plates to have different thickness, or a polarity recognizing mark on at least one electrode plate or combining the recessed shape, different thicknesses, and mark. |
