发明名称 Electrical circuit with contact track layer especially for chip card
摘要 The circuit incorporates a supporting layer (5), a contact track layer (4) with mutually insulated electrically conductive areas, and an electrical component (9) with contacts (14,15) for these areas. A recess (3) is formed through the supporting layer and into the body (2) of the card. At least one of the contacts is located in the vicinity of a boundary wall (17,18) of the recess, into which the contact track layer protrudes. At least one conductive area (6) of this layer is arranged in a region between the contact and the wall.
申请公布号 DE19701163(A1) 申请公布日期 1998.07.16
申请号 DE1997101163 申请日期 1997.01.15
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 MUNDIGL, JOSEF, 93182 DUGGENDORF, DE;PUESCHNER, FRANK, 93309 KELHEIM, DE
分类号 G06K19/077;H01L23/498;H05K1/18;H05K3/00;H05K3/32;H05K13/00;(IPC1-7):H05K1/18;H05K3/30 主分类号 G06K19/077
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