发明名称 |
Electrical circuit with contact track layer especially for chip card |
摘要 |
The circuit incorporates a supporting layer (5), a contact track layer (4) with mutually insulated electrically conductive areas, and an electrical component (9) with contacts (14,15) for these areas. A recess (3) is formed through the supporting layer and into the body (2) of the card. At least one of the contacts is located in the vicinity of a boundary wall (17,18) of the recess, into which the contact track layer protrudes. At least one conductive area (6) of this layer is arranged in a region between the contact and the wall. |
申请公布号 |
DE19701163(A1) |
申请公布日期 |
1998.07.16 |
申请号 |
DE1997101163 |
申请日期 |
1997.01.15 |
申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
MUNDIGL, JOSEF, 93182 DUGGENDORF, DE;PUESCHNER, FRANK, 93309 KELHEIM, DE |
分类号 |
G06K19/077;H01L23/498;H05K1/18;H05K3/00;H05K3/32;H05K13/00;(IPC1-7):H05K1/18;H05K3/30 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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