| 摘要 |
An electronic system having improved thermal transfer from a semiconductor die in a semiconductor device assembly (package) by at least partially filling a cavity in the package with a thermally conductive fluid, immersing a heat collecting portion of a heat pipe assembly into the fluid, and sealing the cavity. In order that the thermally conductive fluid does not chemically attack the die or its electrical connections, the die and connections can be completely covered with an encapsulating coating of an inorganic dielectric material, such as silicon dioxide, by any of a variety of techniques. The heat pipe provides highly efficient heat transfer from within the package to an external heat sink by means of an evaporation-condensation cooling cycle. The optional dielectric coating over the die permits selection of the thermally conductive fluid from a wider range of fluids by isolating the die and its electrical connections from direct contact with the fluid. In another embodiment, an absorptive wick is disposed within the package to transport condensed coolant to close proximity with the die. A heat pipe and wick may be employed in combination, and the heat pipe may have hollow fins, and the wick may extend into the fins (as well as into the package cavity). The use of a wick improves the thermal characteristics of the packaged device irrespective of its physical orientation.
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