| 摘要 |
A projection exposure apparatus includes a reticle stage for moving a reticle, a wafer stage for moving a wafer, a projection optical system for projecting a pattern formed on the reticle onto the wafer, a first supporting device for supporting at least one of the reticle stage and the wafer stage, a measurement device for measuring the position of at least one of the reticle and the wafer, a second supporting device for supporting the measurement device and a displacement/deformation absorber, through which the second supporting device is supported by the first supporting device, for absorbing displacement and deformation of the first supporting device. Also disclosed are exposure methods utilizing such a projection exposure apparatus.
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