| 摘要 |
An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the diffusion of copper from the substrate into the coating layer and the consequential formation of a brittle tin/copper intermetallic, a barrier layer is interposed between the substrate and the coating layer. This barrier layer contains from 10% to 70%, by weight, of nickel and is preferably predominantly comprised of copper. In one embodiment, an intermetallic layer selected from the group (Cu-Ni)3Sn, (Cu-Ni)6Sn5, Cu3Sn, Cu6Sn5 is disposed between the barrier layer and the tin base coating layer.
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