Kühlungsstruktur für integrierte Schaltungen

摘要

A cooling structure for integrated circuits, comprises a plurality of integrated circuits (1); a wiring substrate (2) for mounting said plurality of integrated circuits (1); a plurality of cylindrical pistons (3) each having an open upper portion and a spherical lower surface portion adapted to be in contact with a heat radiating surface of each of said integrated circuits (1); a housing (8) having holes (9) formed correspondingly in position to respective integrated circuits for receiving said pistons (3) respectively; a plurality of nozzles (13) each for jetting liquid coolant through said open upper portion of each piston (3) into a bottom surface thereof; and a cover member (12, 15) fixedly secured to said housing (8) and having coolant passages for supplying said liquid coolant to said nozzles (13) and discharging said liquid coolant jetted through said nozzles (13) outwardly of said pistons (3).