| 摘要 |
In an IC card (30), a highly rigid ceramic frame (38) is buried in a layer formed of a core member (34), and an IC chip (42) is held in an internal space (38a) of the frame (38) through an elastic material (40). Therefore, the IC chip (42) held in the internal space (38a) of the frame (38) is not deformed largely even when strong bending forces, torsional forces, pressing forces, etc., are applied to the IC card (30), nor no shock is transmitted directly to the chip (42) even when shocks are given to the card (30). A coil (44) which is formed by printing, etc., is provided on an upper end face (38b) of the frame (38). The coil (44) is connected to the chip (42) through a wire (46). Since the chip (42), frame (38), and coil (44) are integrally formed in advance, the workability is improved at the time of manufacturing the card (30). Therefore, a highly reliable and inexpensive card mounted with circuit chip, etc., can be provided.
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