发明名称 ADHESIVE TAPE FOR ELECTRONIC PART
摘要 <p>PROBLEM TO BE SOLVED: To prepare an adhesive tape which can be stuck at relatively low temps., can insulate without fail, and has sufficient heat resistance and reliability by forming polyimide-contg. adhesive resin layers on both sides of a polyimide- contg. resin substrate having a glass transition point higher than those of the adhesive layers. SOLUTION: In an adhesive tape formed by successively laminating an adhesive layer A1, a substrate B, and an adhesive layer A2, each of these three layers is a resin layer having a thickness of 5μm or higher and contg. at least one polyimide comprising 100-40mol% at least one kind of structural units selected from among units represented by formulas I and II (wherein Ar is a divalent group selected from among groups represented by formula III; and R<1> to R<4> are each H, a 1-4C alkyl, or a 1-4C alkoxy) and 0-60mol% at least one kind of structural units selected from among units represented by formulas IV and V (wherein R is a 1-10C alkylene or CH2 OC6 H4 of which the methylene group is bonded to Si), and the substrate B has the highest glass transition point of the three layers.</p>
申请公布号 JPH10183097(A) 申请公布日期 1998.07.07
申请号 JP19960349558 申请日期 1996.12.27
申请人 TOMOEGAWA PAPER CO LTD 发明人 OKA OSAMU
分类号 B32B7/12;C09J7/02;C09J179/08;H01L23/50;(IPC1-7):C09J179/08 主分类号 B32B7/12
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