发明名称 MANUFACTURE OF ELECTRONIC PART AND ELECTRONIC PART MANUFACTURED BY THIS METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a part with no jointing by a method wherein a core prepd. by injection molding of a specified resin in a cavity corresponding to the inner face shape of the electronic part is inserted into a cavity corresponding to the outer face shape and a product prepd. by injection of a specified polymer is heated in hot water to dissolve the core and after surface treatment is performed, the circuit is plated and parts except the circuit is covered with the specified polymer. SOLUTION: A core is molded by injecting an oxyalkylene group-contg. polyvinyl alcohol resin into a cavity corresponding to the inner face shape of an electronic part being a final product. A cavity wherein the part of a circuit pattern 1a formed on the surface of the electronic part coincides with the outer shape of a projection is formed and the core is inserted thereinto and after an arom. polyester liq. crystal polymer of a plating grade is injection- molded on the surroundings, the alcoholic resin is dissolved by heating it in hot water and then, after surface roughening treatment is performed, a catalyst is provided and it is placed in a cavity corresponding to the surface of the outer shape and after a liq. polymer of a non-plating grade is injected, plating is performed to form a circuit pattern 1a and a conductive film 1b on the inner peripheral face and as the result, a part with a complicated inner face shape, high quality and low cost can be prepd.
申请公布号 JPH10180799(A) 申请公布日期 1998.07.07
申请号 JP19960355428 申请日期 1996.12.24
申请人 SANKYO KASEI CO LTD 发明人 YUMOTO TETSUO
分类号 B29C33/52;B29C45/14;B29C45/16;B29C45/44;B29L31/34;H05K3/00;H05K3/18;(IPC1-7):B29C45/14 主分类号 B29C33/52
代理机构 代理人
主权项
地址