Concentrate for the electroless deposition of copper coatings on iron and iron alloy surfaces

摘要

Disclosed is a process for the electroless deposition of a copper coating on an iron or iron alloy surface wherein the workpiece surface is contacted with a solution which contains hydrogen ions, 5 to 30 g/l Cu as well as 0.2 to 5 g/l Mg and preferably copper and magnesium with a weight ratio of Cu:Mg of (35 to 5):1 for a treatment time of 3 sec to 15 min at a temperature of the solution of 20 DEG to 65 DEG C. The invention also comprises a solid concentrate for preparing and replenishing the solution for carrying out the process, which consists of at least 85 wt-% CuSO4.5H2O and MgSO4 (anhydrous) with a weight ratio of (35 to 5):1, and preferably contains in addition a maximum of 10 wt-% polyglycol and a maximum of 5 wt-% sodium chloride.