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发明名称
반도체 패키지 테스트용 소켓
摘要
본 고안은 반도체 패키지 테스트에 사용되는 소켓을 분리형으로 개선하여 콘택핀의 파손시 파손된 콘택핀만의 교체가 용이하도록 하므로써 소켓의 사용 수명을 연장시킬 수 있도록 한 것이다. 이를 위해, 본 고안은 QFP 테스트용 소켓(1)이 복수개의 피스로 착탈 가능하게 분리되는 반도체 패키지 테스트용 소켓이다.
申请公布号
KR19980018454(U)
申请公布日期
1998.07.06
申请号
KR19960031866U
申请日期
1996.09.30
申请人
null, null
发明人
김경률
分类号
H01R33/76
主分类号
H01R33/76
代理机构
代理人
主权项
地址
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