发明名称 APPARATUS AND METHOD FOR WET CLEANING OR ETCHING FLAT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To improve flat substrate-treating capability and to enable operation of high cycle time by having means for preventing cleaning liquid or etching liquid from leaking out from a tank through an opening to an environment consisting of a gas or of a mixture of gases. SOLUTION: The apparatus 1 includes a tank 3 having an introducing inlet 5 and an introducing outlet 7 for a substrate 9, and is installed in a gaseous environment 13, e.g. such as a clean room, wherein the tank 3 contains cleaning or etching liquid 11. The introducing inlet 5 and the introducing outlet 7 are present below a liquid surface 15 and formed to be narrow so that the liquid 11 can not flow out due to the effect of the surface tension and/or the capillary action of the liquid 11. The tank 3 is filled with a gas or a mixture of gases with a pressure lower than that within the gaseous environment 13 in an upper portion 25 of the liquid 11. For maintaining the low pressure, a pump 27 is connected to the upper portion 25 and sucks the gas to allow the gas pressure inside the tank 3 to lower. As a result, the leakage of the liquid from the introducing inlet 5 and the introducing outlet 7 of the tank 3 is prevented.
申请公布号 JPH10180196(A) 申请公布日期 1998.07.07
申请号 JP19970166302 申请日期 1997.06.23
申请人 INTERUNIV MICRO ELECTRO CENTRUM VZW 发明人 MEURIS MARC;MERTENS PAUL;HEYNS MARC
分类号 B08B1/00;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):B08B1/00 主分类号 B08B1/00
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