Surface-mounted substrate structure and method

摘要

A surface-mounted substrate structure is provided that includes a substrate (10), a doped semiconductor layer (16), and a dielectric layer (14). The substrate (10) has an upper surface and a lower surface and an interconnect opening (12) extending between the upper surface and the lower surface of the substrate (10). The doped semiconductor layer (16) is positioned within the interconnect opening (12). The doped semiconductor layer (16) is also positioned above the upper surface and below the lower surface of the substrate material (10) in an area surrounding the interconnect opening (12). The dielectric layer (14) is positioned between the doped semiconductor layer (16) and the substrate material (10).