| 摘要 |
A prepreg for a laminate has good heat resistance, electrical insulation properties and adhesion strength of a conductor layer, and may be used to manufacture a printed wiring-board having high density and which likewise has good heat resistance and electrical insulation properties. The prepreg is suitable for use with the conventional production equipment and methods of laminate-pressing. The prepreg is characterized in that a paper-like or fabric-like substrate is dipped in an epoxy resin composition capable of forming a roughened surface through roughening treatment. A laminate may be obtained by using the prepreg and a printed wiring-board obtained by using the laminate. A process for producing the wiring board comprises (1) a step of forming a roughened surface by subjecting the surface of the laminate to the roughening treatment, and (2) a step of forming a conductor layer on the roughened surface of the laminate. A multi-layer printed wiring-board may be produced using a process which comprises (1) a step of laminating the prepreg with an inner layer material such that the prepreg is disposed on the surface, and pressing them to form a laminate, (2) a step of subjecting the surface of the laminate to the roughening treatment to form a roughened surface, and (3) a step of forming a conductor layer on the roughened surface of the laminate. |
