EXTREMELY SMALL ELECTRONIC MODULE WITH OPTICALLY AND MUTUALLY CONNECTED STRUCTURE

摘要

PROBLEM TO BE SOLVED: To reduce the operation cost compared with mutual connection by physical wiring by allowing an optical receiver and an optical transmitter corresponding to it to form a pair of a transmitter and a receiver and making such a prescribed distance and angle as to prevent the overlapping of the optical signals of the pair of the transmitter and receiver. SOLUTION: A multi-chip module 10 is provided with a mutually connecting substrate 12 and the array of the chips 14a to 14i provided by making their edge parts mutually adjacent. The chips 14a to 14i are connected to the substrate 12 through pins. For example, the chip 14g is provided with edge parts 16a to 16d and a bottom surface and the chip 14h is provided with edge parts 18a to 18d and a bottom surface. Each part 16a to 16d is provided with plural optical transmitters (or emitters and optical receivers (detectors). In this case, the chips are desirably arranged at such intervals as to prevent the overlapping of optical beams. The intervals like this decide the fan-shaped areas 26 of the emitters provided between the adjacent chips.