MOUNTING METHOD FOR SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To reduce connection area between the lead-out electrode of a semiconductor chip and the wiring layer of a mounting board. SOLUTION: Under a state where the Ni layer 14c of a lead-out electrode 14 provided on a semiconductor chip 10 is brought into contact with a solder layer 22c on a wiring layer 22 formed on a mounting board 20, the solder layer 22c is irradiated with laser light L from the rear side of the board 20 in order to connect the lead-out electrode 14 with the wiring layer 22. Since the diameter of the laser light L can be reduced to 1-25μm, connection area can be reduced and thereby the size of the lead-out electrode and the chip can e reduced. The solder layer 22c may be omitted. An insulation film 24 may be provided with no contact hole and laser bonding may be performed by breaking the coating.