| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for encapsulating a semi-conductor, which is excellent in photo conductivity of a photo coupler. SOLUTION: This epoxy resin composition for encapsulating a photo semi-conductor contains an epoxy resin, a phenol resin curing agent, silica, and a cure promoter as essential components. In this case, a silica having a particle size not less than 1μm and not more than 10μm is not more than 38wt.%, a silica having a particle size less than 1μm is not more than wt.%, and the silica content in the total epoxy resin composition is 69-75wt.%.</p> |
