发明名称 COMPOSITE SHEET FOR MULTILAYERED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To prevent surface contamination of a metal foil coated with resin for a multilayered wiring board by covering the thermosetting resin surface of the metal foil with an easily strippable resin surface protective sheet. SOLUTION: A thermosetting polyphenylene ether resin layer 2 is formed on one surface of an electrolytic copper foil 3 for a printed board by applying a resin varnish composed of a thermosetting polyphenylene ether resin and a toluene solvent and drying the applied varnish film. Then the easily strippable protective sheet of the metallic foil 3 carrying the thermosetting polyphenylene ether resin layer 2 is formed by press contacting a polyethylene film with the surface of the resin layer 2 with a hot roll maintained at 100 deg.C. Therefore, the reliability of the metallic foil 3 can be improved because the surface of the foil 3 is not contaminated with the thermosetting resin at the time of preserving the foil 3.
申请公布号 JPH10178275(A) 申请公布日期 1998.06.30
申请号 JP19960338250 申请日期 1996.12.18
申请人 ASAHI CHEM IND CO LTD 发明人 KINOSHITA SHOZO;KATAYOSE TERUO
分类号 B32B15/08;H05K3/46;(IPC1-7):H05K3/46 主分类号 B32B15/08
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