发明名称 |
COMPOSITE SHEET FOR MULTILAYERED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To prevent surface contamination of a metal foil coated with resin for a multilayered wiring board by covering the thermosetting resin surface of the metal foil with an easily strippable resin surface protective sheet. SOLUTION: A thermosetting polyphenylene ether resin layer 2 is formed on one surface of an electrolytic copper foil 3 for a printed board by applying a resin varnish composed of a thermosetting polyphenylene ether resin and a toluene solvent and drying the applied varnish film. Then the easily strippable protective sheet of the metallic foil 3 carrying the thermosetting polyphenylene ether resin layer 2 is formed by press contacting a polyethylene film with the surface of the resin layer 2 with a hot roll maintained at 100 deg.C. Therefore, the reliability of the metallic foil 3 can be improved because the surface of the foil 3 is not contaminated with the thermosetting resin at the time of preserving the foil 3. |
申请公布号 |
JPH10178275(A) |
申请公布日期 |
1998.06.30 |
申请号 |
JP19960338250 |
申请日期 |
1996.12.18 |
申请人 |
ASAHI CHEM IND CO LTD |
发明人 |
KINOSHITA SHOZO;KATAYOSE TERUO |
分类号 |
B32B15/08;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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