| 摘要 |
PROBLEM TO BE SOLVED: To reduce the circuit area which is needed for the test/emulation by preparing a signal collector used for the bond pad access of an embedded core. SOLUTION: A test point where most of a test circuit is independent of a function circuit and must be mixed with the function circuit is set at a strategic point that is included in a range of the function circuit which can be tested. In other words, the function circuit performs the normal working function of an integrated circuit, includes plural nodes which are distributed across the integrated circuit and is provided with a conductive signal collector 43 which has the wide length across the integrated circuit. Many signal paths are connected to the collector 43 at each point accordant with the length of every path, and every signal can be connected to each node. The bond pads 1 to 256 can be selectively connected to the collector 43 and receive the signals collected from the signal paths from the collector 43. |
