| 摘要 |
PROBLEM TO BE SOLVED: To manufacture the title semiconductor device made of lead frame having low cost adhesive member by a method wherein the adhesive member for fixing inner leads 1 and a semiconductor chip 2 is formed non-continuously with one another on the backside of the whole front ends or partialy on the backside of partial front ends. SOLUTION: Within the title LOC structured semiconductor device, a plurality of inner leads 1 are extended onto semiconductor chip 2 while the front ends 1a of these inner leads 1 and the chip electrodes 2a formed in one line on the central part of the semiconductor chip 2. corresponding to the front ends 1a are connected to one another through the intermediary of the bonding wires 3. Besides, the inner leads 1 are press-worked from the opposite surface to the inverse surface of the semiconductor chip, 2 on the back side of the inner leads 1. Furthermore, the backside of the front ends 1a postioned on the four corners is coated with an adhesive 4. In such a constitution, the inner leads 1 and the semiconductor chip 2 are junctioned with one another by thermocompression bonding the former to the latter.
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