发明名称 |
CERAMIC ELECTRONIC PARTS AND ITS MANUFACTURE |
摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability between outer electrodes and inner electrodes and to improve density of the outer electrodes for a multilayer ceramic capacitor or the like. SOLUTION: Conductive paste containing thermosetting resin 6 exhibiting a heat resistance up to 400 deg.C or higher such as polyimide base resin and metallic powder 7 containing at least 5vol% of powder whose average particle size is 1.0μm or smaller is prepared for forming an outer electrode 5. The conductive paste is applied to the surface of a ceramic body 2. The applied conductive paste is subjected to temperature of 400 deg.C or higher in order that at least a part of the metallic powder 7 whose average particle size is 1.0μm-of smaller may be joined to the inner electrode 4 by mutual diffusion.
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申请公布号 |
JPH10172859(A) |
申请公布日期 |
1998.06.26 |
申请号 |
JP19960330117 |
申请日期 |
1996.12.11 |
申请人 |
MURATA MFG CO LTD |
发明人 |
SANADA YUKIO;ITO EIJI;WADA HISASHI;HAMADA KUNIHIKO;YONEDA YASUNOBU |
分类号 |
H01G4/12;H01G4/232;H01G4/30;(IPC1-7):H01G4/12 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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