| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste that is unlikely to crack when baked, can achieve high reliability for conduction, and can form via holes excellent in solderability and platablity and to provide a method for manufacturing a ceramic substrate using the same. SOLUTION: A conductive paste 3, obtained when 80 to 93wt.%, spherical or granular conductive metallic powders with grain diameters in the range of 0.1 to 50μm, 2 to 10wt.%. insoluble resin powders with grain diameters in the range of 0.1 to 50μm, and 5 to 18wt.% organic vehicle are blended together, is packed in holes 2 for via holes formed in ceramic green sheets 1, and after the ceramic green sheets 1 are stacked and compression-bonded together, they are baked under predetermined conditions. |
