| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic parts molding method with no quality trouble of electronic parts package such as non-filling of resin, break of honding wire and void generation and electronic parts molding device using its electronic parts molding die. SOLUTION: When a plunger 6 is moved up in the state of a closed shutter 7, thermosetting epoxy resin in a thermosetting epoxy resin packing is melted so as to start to flow along and break a thermocrimping and sealing part S so as to reach a shutter 7. When all thermocrimping and sealing parts S of respective runners 3... corresponding to a plurality of cavities 1... are broken and molten theremostting epoxy resin arrives at the regions of the shutters 7... of the respective runners 3.... Then, the respective shutters 7... are opened so as to fill the respective cavities 1... with thermosetting epoxy resin for being pressure-transferred. |
