| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve higher production efficiency and quality guaranteeing a printed wiring board in order to superpose copper clad laminate by using resin films with no paste applied on their cross-sectional parts and on the peripheral parts of their both sides, and by heating and press-bonding them. SOLUTION: Both sides of the outermost layer of standard-size copper clad laminating plates having two or more wiring layers are formed of outer layer conductors. Then, these standard-size copper clad laminating plates are cut into panel-size copper clad laminating plates by using an automatic cutting machine, and end surface beveling and corner processing are carried out. Then, an upper backing plate 5 (bakelite plate, aluminum plate), plural superposed copper clad laminating plates 6, and a lower backing plate (bakelite plate) 7 are sequentially superposed to construct a composite material. Then, to the composite material, formed by applying the backing plates on both sides of plural superposed copper clad laminating plates 6, resin films 8 with no paste applied are press-bonded onto the end surface parts thereof and on the parts of both sides thereof in the range within, e.g. 5mm from the peripheral end surface by using a heating and a press-bonding machine. As a result, superposed formation 10 of the copper clad laminating plates in which a through hole is to be performed can be obtained.</p> |
