COMPOSITION FOR POLISHING

摘要

PROBLEM TO BE SOLVED: To suppress a decrease in speed for polishing a surface to be polished even after repetitive use by specifying an electric conductivity of a composition for polishing containing colloidal silica and water. SOLUTION: This composition for polishing is adjusted by mixing, and dispersing or dissolving colloidal silica, and a basic potassium compound as required, with/to water at a desired percentage content. The colloidal silica is aqueous colloidal silica or gel silica each including all of stable dispersing elements of amorphous silica in a liquid and its percentage content is preferably 0.1 to 30wt.% of the total quantity of the composition for polishing. It is preferable to further add the basic potassium compound to the compound for polishing and the compound promotes polishing to a surface to be polished by a chemical action and also acts as a dispersant of a main polishing material. Further, the electric conductivity of the composition for polishing is 30 to 5000μS/cm.