| 摘要 |
In a process for the coating of boards (4) with a poured material (L), especially for the coating of printed circuit boards with, for example, solder resist, the boards (4) to be coated are transported through and beneath a curtain of poured material descending transversely to the transport direction and the poured material descending in the form of a pouring curtain (LV) thus falls onto the boards (4). The descending pouring curtain (LV) falls onto a planar deflector surface (20) before falling onto the board (4), with an acute angle ( alpha ) being formed between the deflector surface (20) and the plane of the pouring curtain (LV), which deflector surface (20) has a cut-off edge (21) at its lower end. After falling onto the deflector surface (20), the poured material runs along that deflector surface (20) downwards towards the cut-off edge (21) and then descends onto the board (4). |
