| 摘要 |
PROBLEM TO BE SOLVED: To upgrade chargeability in the case of forming a card, to prevent unevenness of a surface of the card and to alleviate a stress to be applied to an IC chip by allowing relationship between elastic moduli of charging resin, cover and core sheets and relationship between thicknesses of the core sheet and the chip to respectively satisfy specific formulae. SOLUTION: Since adhesive resin 2 coating a cover sheet 1 is wound on a roll and stored, it needs viscosity of hardness of certain degree or more. Accordingly, resin composition considering storage stability is required. That is, elastic moduli EIC, ES, EC of a charging resin layer, cover sheet and core sheet and thicknesses TC, TIC of the core sheet, IC satisfy formulae ES/EIC>1. EC/EIC>1, and TC/TIC>1. Thus, a stress applied to the chip can be reduced, and an IC adapted to mass production by in line can be obtained. |
