发明名称 |
Thermosetting encapsulants for electronics packaging. |
摘要 |
An electronic package is provided where in a semiconductor device on a substrate is encapsulated with a thermally reworkable encapsulant composition including: (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one filler present from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable electronic package. |
申请公布号 |
ZA9711197(B) |
申请公布日期 |
1998.06.23 |
申请号 |
ZA19970011197 |
申请日期 |
1997.12.12 |
申请人 |
SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ BV. |
发明人 |
SHRIDHAR RATNASWAMY IYER;PUI KWAN WONG |
分类号 |
C08L73/00;H01L21/52;H01L23/29;H01L23/31 |
主分类号 |
C08L73/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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