发明名称 APPARATUS AND METHOD FOR MOLDING FOR MICROSYSTEM STRUCTURE
摘要 PROBLEM TO BE SOLVED: To compensate a difference in thickness of a molding tool and a molding material used for a vacuum embossing process and also to ensure a different molding depth, while ensuring high dimensional stability. SOLUTION: A molding apparatus has a pair of chamber parts 6 and 7 constituting a closable chamber and disposed opposite to each other. The fixed chamber part 6 on one side is fixed to a frame, while the movable chamber part 7 on the other side is guided movably by the frame. The chamber has a side wall constituted of first and second cylindrical flanges 19 and 23 and the first flange 19 is fitted to the fixed chamber part 6. The second flange 23 has an end face 29 which the movable chamber part 7 presses against the force of a spring 26 at the time of closure of the chamber, and also it is movable along a guide sleeve 18 between two stoppers 27 and 28. Environmental conditions and a molding temperature in the chamber are set in the stage at the time of closure of the chamber wherein an increase in a force acting on the fixed chamber part 6 reaches a prescribed value.
申请公布号 JPH10156943(A) 申请公布日期 1998.06.16
申请号 JP19970274296 申请日期 1997.10.07
申请人 JENOPTIK AG 发明人 MUELLER LUTZ;REUTHER FRANK;SPRINGER ALF;HECKELE MATTHIAS;BIEDERMANN HANS
分类号 B29C43/02;B29C43/56;B29C59/02;(IPC1-7):B29C59/02 主分类号 B29C43/02
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