发明名称 BASE MATERIAL CONNECTING METHOD AND BASE MATERIAL CONNECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To perform excellent work by which cutting, separation and meandering of base materials, a variation in tension or the like are not caused by sandwiching a thermoplastic polyimide film between the base materials to be connected by the base materials to be worked by applying tensile force of a specific range in a specific temperature range, and connecting them to each other by thermocompression bonding. SOLUTION: In base materials to be continuously worked in 0.1 to 50kgf/m of tensile force applied to the base materials in a temperature range of 200 deg.C to 550 deg.C, before passing through a heat press machine 1, the final part of a preceding base material 4 and the forefront part of a work, expected base material 6 sandwich a thermoplastic polyimide film 5, and are superposed on each other, and are temporarily connected to each other by a pressure sensitive adhesive tape 7. When a temporarily connecting part reaches the heat press machine 1, a part of the base material 4 at working time is fixed by a base material fixing device 2, and the temporarily connecting part rests in the heat press machine 1. The heat press machine 1 is actuated, and the base materials 4 and 6 having the thermoplastic polyimide film 5 between them is subjected to thermocompression bonding. Next, the connecting part moves toward an accumulator 3.
申请公布号 JPH10157896(A) 申请公布日期 1998.06.16
申请号 JP19960317619 申请日期 1996.11.28
申请人 MITSUI CHEM INC 发明人 TAGAWA KIMITERU;KIJIMA SHIGEKI;KOBAYASHI YOSHITAKE;OTSUBO EIJI
分类号 B65H21/00;B29C65/48;B29L7/00;B31F5/06;B65H19/18 主分类号 B65H21/00
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