SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURE THEREOF, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT

摘要

A semiconductor device whose package size is nearly the same as the size of a chip, and which can effectively absorb thermal stress in addition to a stress absorbing layer. A semiconductor device (150) has semiconductor chip having an electrode (158), a resin layer (152) formed as a stress reducing layer on the semiconductor chip, an interconnect (154) which is formed on the entire surface including the electrode (158) and the resin layer (152), and a solder ball (157) which is formed on a part of the interconnect (154) which is formed on the resin layer (152). The resin layer (152) is so formed as to have a recess (152a) on its surface and the interconnect (154) is so formed as to also cover the entire surface including the recess (152a).