| 摘要 |
PROBLEM TO BE SOLVED: To provide a chemical machine grinding device capable of reducing dispersion concerning recovery of a pad surface by dressing and precisely and stably recovering the pad surface. SOLUTION: A grinding pad 107 is adhered on an upper surface of a platen 101, and a wafer carrier 111 to hold a wafer 109 to be ground against a pad surface 107a is provided above this polishing pad 107. This wafer carrier 111 is constituted free to make the wafer 109 precisely contact with the pad surface 107a. A dresser part 113 to recover the pad surface 107a is provided on the wafer carrier 111, and this dresser part 113 is constituted to vertically move. A ring shape dresser is provided on a lower part of the dresser part 113. Consequently, it is possible to reduce dispersion concerning recovery of the pad surface by dressing and to precisely and stably recover the pad surface. |
