| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board from which the resin left in the bottom section of an opening for forming via hole can be removed completely during the manufacturing process of the wiring board and which has via holes having high connection reliability and a method for manufacturing the wiring board. SOLUTION: In a multilayered wiring board in which an inner-layer conductor circuit and an outer-layer conductor circuit is laminated upon another with an interlayer insulating material layer in between and both the conductor circuits are electrically connected to each other through a via hole formed through the insulating material layer, a desmear layer which can be removed by formation treatment is formed on at least the part the lower surface side of the insulating material layer which is in contact with the inner-layer conductor circuit. In a method for manufacturing the multilayered printed wiring board, a desmear layer is formed at, at least, the part of the insulating material layer which is brought into contact with the inner-layer conductor circuit at the time of forming the insulating material layer on the substrate on which the inner-layer conductor circuit is formed. |
