| 摘要 |
PROBLEM TO BE SOLVED: To enable the firm bonding of a resin to a substrate by controlling the temperature in an interface where the substrate is brought into contact with the resin and the viscosity of the resin therein. SOLUTION: A resin 5 curable with electromagnetic wave energy at <=400nm wavelength (e.g. an allyl ester-based resin) is fed to either one of a metallic mold 3 having an optical surface 3a for forming a resin layer and a substrate 1 made of a glass and the metallic mold 3 and the substrate 1a are relatively approached to extend the resin 5. Thereby, a resin layer is formed between the metallic mold 3 and the substrate 1 and then cured by irradiation of an energy. The metallic mold 3 is subsequently peeled from the cured resin layer to afford the objective element. In the process, at least either one of the resin 5 and the substrate 1 is controlled so that the temperature of the interface where the substrate 1 is brought into contact with the resin 5 may be >=30 deg.C and the viscosity of the resin 5 may be <=2,500cP when the substrate 1 is preferably heated and the resin layer starts the curing. When a resin having >2,500cP viscosity at 30C is used, the resin temperature is increased to >=30 deg.C to regulate the resin viscosity to <=2,500cP. |
