| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a blind via hole on a TAB(tape automated bonding) tape, which is improved to obtain a blind via hole of higher reliability. SOLUTION: In a method for forming a blind via hole on a TAB tape, after one copper foil 1 so a copper foil/polyimide/copper foil constitution which constitutes a two-layer CCL(copper clad laminate) is coated with a photoresist, blind via hole pattern 9 is formed. The a polyimide 2 is removed, and a blind via hole 4 is formed corresponding to the blind via hole pattern 9. Then the polyimide 2 accumulated on a bottom part of the blind via hole 4 is removed, and then the surface of the other copper foil 1 exposed from the bottom surface of the blind via hole 4 is removed by etching. Furthermore, until residual quantity of accumulated organic insulation material is eliminated, the process in which the polyimide 2 is removed and the process in which the surface of the other copper foil 1 exposed from the bottom part of the blind via hole 4 is removed by etching are repeated. |
