| 发明名称 |
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| 摘要 |
A thin-film arrangement for a non-planar structure is described. The structure includes a substrate (14) and a plurality of thin-film layers stacked on top of each other above the substrate. The layers contain conductive patterns (27-30) and vias (19-26) that provide connections between the conductive pattern in one of the layers to the conductive pattern in another layer. Vias that provide a connection between the conductive pattern of one layer are offset and in contact with respect to each other and are positioned in a non-linear arrangement, preferably in the form of a helix or a multiple helix. <IMAGE> |
| 申请公布号 |
JP2760945(B2) |
申请公布日期 |
1998.06.04 |
| 申请号 |
JP19940047228 |
申请日期 |
1994.03.17 |
| 申请人 |
INTAANASHONARU BIJINESU MASHIINZU CORP |
发明人 |
MAIKERU FUOODO MAKUARISUTAA;JEIMUZU AREKISANDAA MAKUDONARUDO;KESHAU PURASADO;GOODON JAI ROBINZU;MADOHAUAN SUWAMINASAN |
| 分类号 |
H01L23/12;H01L21/768;H01L23/522;H01L23/538;(IPC1-7):H01L21/768 |
主分类号 |
H01L23/12 |
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