Integrerad mikrovåghybridkrets

摘要

The microwave hybrid integrated circuit, is providing having a dielectric board (1) provided with a topological metallization pattern (2) and a number of recesses (3) in which semiconductor chips (5) are fixed with a binder (4). The face surface of the chips (5) provided with contact pads (6) are coplanar with the surface of the board (1), and the contact pads (6) of the chips (5) are electrically connected to the topological metallization pattern (2). The walls of the recesses (3) are inclined towards the plane of the board (1) at an angle (alpha) of 90.1 to 150°.