| 摘要 |
<p>#CMT# #/CMT# The heat distributor (3) comprises a base plate (11) which is connected with a power semiconductor element. The base plate has a recess (12), where a heat pipe (13) is pivoted in the recess. A heat coupling element (4) is connected with a power semiconductor component in a heat conducting manner. The heat coupling element is made of copper, aluminum or magnesium, where the heat coupling element has a surface coating of nickel layer. #CMT#USE : #/CMT# Heat distributor for removing heat. #CMT#ADVANTAGE : #/CMT# The heat distributor comprises a base plate which is connected with a power semiconductor element, and the base plate has a recess, where a heat pipe is pivoted in the recess, where a heat coupling element is connected with a power semiconductor component, thus ensures an improved heat distributor. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a perspective view of a heat distributor. 3 : Heat distributor 4 : Heat coupling element 11 : Base plate 12 : Recess 13 : Heat pipe.</p> |
