Method of selectively removing a metallic layer from a non-metallic substrate

摘要

A method of selectively removing a metallic layer (3) from a non-metallic substrate (1) includes the steps of arranging for the metallic layer (3) to be overlaid by a coating (7) of Sn-rich metallic material, and directing a laser beam of wavelength lambda onto a selected area (5') of the coating (7), lambda being chosen to lie in the range 450-650 nm, thereby causing localized heating of the coating (7) in this area (5') and consequent ablative removal of the underlying portion of the metallic layer (3). The method is particularly useful in the manufacture of printed circuit boards.