| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method for a field emission type element by which reproducibility and production yield in a lift-off process, which affects the reproducibility and the production yield in the manufacturing process, can be improved. SOLUTION: A stop layer 2 is formed on an insulating substrate 1 by evaporation, a base layer 4 to become a base electrode is formed on the stop layer 2 by evaporation, and a resistor layer 5, an emitter layer 6, a silicon layer 12, and a peeling layer 7 are successively deposited on the base layer 4 by sputtering. Then, a photoresist pattern with an emitter shape is formed on the peeling layer 7 and using the photoresist pattern, the peeling layer 7, silicon layer 12, the emitter layer 6, and the resistor layer 5 are patterned by reactive ion etching to form a recessed part 13. At the time of evaporation process, the recessed part 13 reliably retains an aperture part of the peeling layer, so that an etchant can easily enter at the time of lift-off of the peeling layer 7 and uniform and quick lift off can be carried out.</p> |
