| 摘要 |
PROBLEM TO BE SOLVED: To enable smooth transportation of a wafer when the wafer is transported between a system having a processor and a device other than the system through an interface, and also to minimize an installation space even when the wafer has a large diameter. SOLUTION: A vertically movable substrate mounting section 33 is provided on a base of an interface section. A first mounting part 34 is provided on an upper stage of the substrate mounting section 33 and a second mounting part 35 is provided on a lower stage thereof. The substrate mounting section 33 is moved up or down when a wafer is fed from or into a system to position the first and second mounting parts 34 and 35 at the same level. |
