发明名称 |
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF |
摘要 |
A plurality of connecting leads, each consisting of an internal lead and an external lead, are provided so as to extend inward from a lead frame main body, and are then cut off the lead frame main body. The connecting leads are electrically connected with an aluminum electrode of the semiconductor chip. A plurality of fixing leads, each having a distal end bent toward the semiconductor, are provided so as to extend inward from the lead frame main body and thereafter are cut off the lead frame main body. The semiconductor chip is clamped by the distal ends of the fixing leads. The semiconductor chip, the plural connecting leads and the plural fixing leads are sealed together into a resin package. <IMAGE> |
申请公布号 |
KR0140675(B1) |
申请公布日期 |
1998.06.01 |
申请号 |
KR19940028898 |
申请日期 |
1994.11.04 |
申请人 |
MATSUSHITA ELECTRIC IND. CO.,LTD |
发明人 |
OCHI, TAKAO;FUNAKOSHI, HISASHI;HATADA, KENJO;WAKABAYASHI, TAKASHI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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