发明名称 |
SEALED ELECTRONIC PACKAGING FOR ENVIRONMENTAL PROTECTION OF ACTIVE ELECTRONICS. |
摘要 |
<p>An environmentally sealed electronics assembly. The assembly includes a flexible envelope surrounding the active electronics board. The electronics board is insertable into the envelope and with subsequent sealing provides a reenterable but environmentally sealed active electronics package. Methods of manufacturing the assembly are also described.</p> |
申请公布号 |
MX9604718(A) |
申请公布日期 |
1998.05.31 |
申请号 |
MX19960004718 |
申请日期 |
1995.04.06 |
申请人 |
RAYCHEM CORPORATION |
发明人 |
STEPHEN DIAZ;DAVE HORSMA;PETER LUNDQUIST;NELSON SHEN;PAUL VON DER LIPPE;NARENDRA KULKARNI;AKIRA NAKAZATO |
分类号 |
H05K3/28;H05K5/00;H05K5/06;(IPC1-7):H05K05/06 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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