| 摘要 |
The invention relates to a method for the production of a protecting device for optical waveguide splices. The protective device consists of two oblong wafers (3, 31) of brittle material. The wafers (3, 31) are produced with an intensity of 15-300 mu m and, during or immediately after production, are provided with a thin protecting layer (4) that prevents stress corrosion cracking.
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