发明名称 MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To alleviate an ejection force by rotation by quenching a mold in opening the mold or releasing a molding from the mold by reducing a releasing resistance when the molding is released from the mold while rotating. SOLUTION: A cooling water hole 10 of a mechanism for passing cooling water is provided in a mold 3 for forming a cavity. Prior to the molding (charging resin), the mold 3 is closed, and simultaneously the molds 1, 2 are heated by a heater 9. Molding is started when it arrives at a predetermined temperature (e.g. 160 deg.C). Curing is finished, and then the mold is opened. Simultaneously, a heater 9 is deenergized, cooling water is passed through the hole 10 to start cooling. When it becomes a predetermined temperature (e.g. 120 deg.C) or lower, the molding is released, and removed. Thus, a difference of thermal expansions of the mold 2 of the metal cooled and the molding of the resin is utilized to generate a gap at an interface between the mold 2 and the molding, and the molding is easily released while rotating the molding.
申请公布号 JPH10138255(A) 申请公布日期 1998.05.26
申请号 JP19960300271 申请日期 1996.11.12
申请人 SUMITOMO BAKELITE CO LTD 发明人 YOSHIZUMI FUMINARI
分类号 F04D29/26;B29C33/44;B29C45/44;B29C45/73;B29L31/00;(IPC1-7):B29C33/44 主分类号 F04D29/26
代理机构 代理人
主权项
地址