| 摘要 |
A thermal processing apparatus for processing a wafer is disclosed. The thermal processing apparatus includes a thermal processing plate, a plurality of spacers, a plurality of locators, and a plurality of sensors. The temperature of the thermal processing plate is controlled within a predetermined range. The spacers are arranged over the thermal processing plate for supporting the wafer, thereby forming a gap between the wafer and the thermal processing plate. The locators, each of which is disposed over one of the spacers, are provided for locating the wafer. The sensors, each of which is disposed over one of the locators, are provided for detecting the position of the wafer.
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