发明名称 SOLDER ALLOY
摘要 <p>PROBLEM TO BE SOLVED: To improve the fatigue strength of a soldered part by containing Sn, Sb, Ag, P, Pb, Cu, Bi, Ni, Ge, Te, Ga and In of the prescribed quantity in the solder. SOLUTION: The solder has the composition consisting of, by weight, 50-80% Sn, 0.05-10% Sb, 0.0001-5% Ag, 0.0001-0.5% P, and at least one kind of the element S to be selected among 0.01-1% Cu, 0.01-5% Bi, 0.01-5% Ni, 0.001-0.5% Ge, 0.001-1% Te, 0.001-1% Ga, and 0.001-1% In, and the balance substantially Pb. Sb increases the strength. If Sb is excessive, the flowability of the solder is reduced. Ag increases the strength and improves the softness. P increases the strength, suppresses the oxidizing reaction, and improves the stress resistance to withstand the thermal stress and vibration of a soldered part. If P is excessive, the flowability of the solder is reduced.</p>
申请公布号 JPH10137971(A) 申请公布日期 1998.05.26
申请号 JP19970303185 申请日期 1997.11.05
申请人 SAMSUNG ELECTRON CO LTD 发明人 AN KYOKI;KAN ZAIKO;KIN JINTETSU
分类号 B23K35/22;B23K35/26;C22C13/02;(IPC1-7):B23K35/26 主分类号 B23K35/22
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