| 摘要 |
A lead press mechanism is suitable for a self-drop type test handler for establishing an electrical contact between the lead terminals of IC devices to be tested and the contact terminals without deforming the lead terminals or adversely affecting the IC device testing. The lead press mechanism especially suitable for testing mold-framed IC devices. The lead press mechanism includes an IC device interface assembly for interfacing an IC device to be tested with an IC tester through IC socket terminals to provide test signals from the IC tester to the IC device and to send resulting output signals from the IC device to the IC tester; a lead press assembly having a guide mechanism including a contact rail for guiding the IC device in a vertical direction to a predetermined test position, a lead press for pressing lead terminals of the IC device against the IC socket terminals by protruding beyond the contact rail, and an elastic member which allows the lead press an additional movement against the force of the elastic member; and a distance mechanism for determining a distance between the IC device interface assembly and the lead press assembly when the when IC device interface assembly and the lead press assembly engage with each other./!
|
